multiphysics heat transfer model Search Results


three-dimensional steady-state heat transfer model comsol multiphysics  (COMSOL Inc)
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Three Dimensional Steady State Heat Transfer Model Comsol Multiphysics, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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multiphysics heat transfer model  (COMSOL Inc)
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COMSOL Inc multiphysics heat transfer model
Multiphysics Heat Transfer Model, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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finite element heat transfer model comsol multiphysics v 4.2  (COMSOL Inc)
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COMSOL Inc finite element heat transfer model comsol multiphysics v 4.2
Finite Element Heat Transfer Model Comsol Multiphysics V 4.2, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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pennes bioheat equation in a comsol multiphysics heat transfer model  (COMSOL Inc)
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COMSOL Inc pennes bioheat equation in a comsol multiphysics heat transfer model
Pennes Bioheat Equation In A Comsol Multiphysics Heat Transfer Model, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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pennes bio-heat transfer model in comsol multiphysics  (COMSOL Inc)
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COMSOL Inc pennes bio-heat transfer model in comsol multiphysics
Pennes Bio Heat Transfer Model In Comsol Multiphysics, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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simulation model comsol multiphysics conjugate heat transfer module  (COMSOL Inc)
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Simulation Model Comsol Multiphysics Conjugate Heat Transfer Module, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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three-dimensional heat transfer model using comsol multiphysics 4.2a software  (COMSOL Inc)
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COMSOL Inc three-dimensional heat transfer model using comsol multiphysics 4.2a software
Three Dimensional Heat Transfer Model Using Comsol Multiphysics 4.2a Software, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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3d heat transfer model comsol multiphysics v5.6  (COMSOL Inc)
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COMSOL Inc 3d heat transfer model comsol multiphysics v5.6
(a) Thermal images of ITO-10 NP samples printed with different parameters, exposed to IR lamp irradiation (100 W@50 cm), acquired ad different times, as in panel (b); sample 25DS 1 L, 25DS 2 L, 25DS 2 L, and 25DS 2 L refer to various combinations of drop spacing (DS = 25, 50 μm) and number of printed layers (L = 1, 2). (b) Thermal dynamics of the same samples, averaged with an ROI (region of interest) of 0.5 × 0.5cm 2 placed in the center of the printed squares. Irradiation with the IR lamp starts at 0 s and ends at 36 s. (c) Evaluation of thermal pattern resolution considering the two different designs “interline” and “linewidth”, performed on a specific printed sample exposed to the IR lamp (100 W@50 cm): interline on the left has widths of 2500, 1000, 500, and 250 μm (from top to bottom); linewidth on the right has widths of 2500, 1000, 500, and 250 μm (from top to bottom). (d) Simulated thermal image of the 25DS 1 L square sample (1 cm side) obtained by finite element modeling (FEM) <t>Multiphysics</t> software. (e) Thermal resolution, evaluated as the gradient of temperature along the x axis at the edge of the ITO square vs substrate thickness and time, obtained by simulation. Timestamp in panels (a), (c), and (d) indicates the time elapsed from IR irradiation starting.
3d Heat Transfer Model Comsol Multiphysics V5.6, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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3d integrated heat transfer model with the stick-slip condition using comsol multiphysics  (COMSOL Inc)
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COMSOL Inc 3d integrated heat transfer model with the stick-slip condition using comsol multiphysics
(a) Thermal images of ITO-10 NP samples printed with different parameters, exposed to IR lamp irradiation (100 W@50 cm), acquired ad different times, as in panel (b); sample 25DS 1 L, 25DS 2 L, 25DS 2 L, and 25DS 2 L refer to various combinations of drop spacing (DS = 25, 50 μm) and number of printed layers (L = 1, 2). (b) Thermal dynamics of the same samples, averaged with an ROI (region of interest) of 0.5 × 0.5cm 2 placed in the center of the printed squares. Irradiation with the IR lamp starts at 0 s and ends at 36 s. (c) Evaluation of thermal pattern resolution considering the two different designs “interline” and “linewidth”, performed on a specific printed sample exposed to the IR lamp (100 W@50 cm): interline on the left has widths of 2500, 1000, 500, and 250 μm (from top to bottom); linewidth on the right has widths of 2500, 1000, 500, and 250 μm (from top to bottom). (d) Simulated thermal image of the 25DS 1 L square sample (1 cm side) obtained by finite element modeling (FEM) <t>Multiphysics</t> software. (e) Thermal resolution, evaluated as the gradient of temperature along the x axis at the edge of the ITO square vs substrate thickness and time, obtained by simulation. Timestamp in panels (a), (c), and (d) indicates the time elapsed from IR irradiation starting.
3d Integrated Heat Transfer Model With The Stick Slip Condition Using Comsol Multiphysics, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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Average 90 stars, based on 1 article reviews
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multiphysics 5.5 heat transfer model  (COMSOL Inc)
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COMSOL Inc multiphysics 5.5 heat transfer model
(a) Thermal images of ITO-10 NP samples printed with different parameters, exposed to IR lamp irradiation (100 W@50 cm), acquired ad different times, as in panel (b); sample 25DS 1 L, 25DS 2 L, 25DS 2 L, and 25DS 2 L refer to various combinations of drop spacing (DS = 25, 50 μm) and number of printed layers (L = 1, 2). (b) Thermal dynamics of the same samples, averaged with an ROI (region of interest) of 0.5 × 0.5cm 2 placed in the center of the printed squares. Irradiation with the IR lamp starts at 0 s and ends at 36 s. (c) Evaluation of thermal pattern resolution considering the two different designs “interline” and “linewidth”, performed on a specific printed sample exposed to the IR lamp (100 W@50 cm): interline on the left has widths of 2500, 1000, 500, and 250 μm (from top to bottom); linewidth on the right has widths of 2500, 1000, 500, and 250 μm (from top to bottom). (d) Simulated thermal image of the 25DS 1 L square sample (1 cm side) obtained by finite element modeling (FEM) <t>Multiphysics</t> software. (e) Thermal resolution, evaluated as the gradient of temperature along the x axis at the edge of the ITO square vs substrate thickness and time, obtained by simulation. Timestamp in panels (a), (c), and (d) indicates the time elapsed from IR irradiation starting.
Multiphysics 5.5 Heat Transfer Model, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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coupled electromagnetic and heat transfer model comsol multiphysics  (COMSOL Inc)
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COMSOL Inc coupled electromagnetic and heat transfer model comsol multiphysics
(a) Thermal images of ITO-10 NP samples printed with different parameters, exposed to IR lamp irradiation (100 W@50 cm), acquired ad different times, as in panel (b); sample 25DS 1 L, 25DS 2 L, 25DS 2 L, and 25DS 2 L refer to various combinations of drop spacing (DS = 25, 50 μm) and number of printed layers (L = 1, 2). (b) Thermal dynamics of the same samples, averaged with an ROI (region of interest) of 0.5 × 0.5cm 2 placed in the center of the printed squares. Irradiation with the IR lamp starts at 0 s and ends at 36 s. (c) Evaluation of thermal pattern resolution considering the two different designs “interline” and “linewidth”, performed on a specific printed sample exposed to the IR lamp (100 W@50 cm): interline on the left has widths of 2500, 1000, 500, and 250 μm (from top to bottom); linewidth on the right has widths of 2500, 1000, 500, and 250 μm (from top to bottom). (d) Simulated thermal image of the 25DS 1 L square sample (1 cm side) obtained by finite element modeling (FEM) <t>Multiphysics</t> software. (e) Thermal resolution, evaluated as the gradient of temperature along the x axis at the edge of the ITO square vs substrate thickness and time, obtained by simulation. Timestamp in panels (a), (c), and (d) indicates the time elapsed from IR irradiation starting.
Coupled Electromagnetic And Heat Transfer Model Comsol Multiphysics, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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multiphysics conductive and radiative heat transfer model  (COMSOL Inc)
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COMSOL Inc multiphysics conductive and radiative heat transfer model
(a) Thermal images of ITO-10 NP samples printed with different parameters, exposed to IR lamp irradiation (100 W@50 cm), acquired ad different times, as in panel (b); sample 25DS 1 L, 25DS 2 L, 25DS 2 L, and 25DS 2 L refer to various combinations of drop spacing (DS = 25, 50 μm) and number of printed layers (L = 1, 2). (b) Thermal dynamics of the same samples, averaged with an ROI (region of interest) of 0.5 × 0.5cm 2 placed in the center of the printed squares. Irradiation with the IR lamp starts at 0 s and ends at 36 s. (c) Evaluation of thermal pattern resolution considering the two different designs “interline” and “linewidth”, performed on a specific printed sample exposed to the IR lamp (100 W@50 cm): interline on the left has widths of 2500, 1000, 500, and 250 μm (from top to bottom); linewidth on the right has widths of 2500, 1000, 500, and 250 μm (from top to bottom). (d) Simulated thermal image of the 25DS 1 L square sample (1 cm side) obtained by finite element modeling (FEM) <t>Multiphysics</t> software. (e) Thermal resolution, evaluated as the gradient of temperature along the x axis at the edge of the ITO square vs substrate thickness and time, obtained by simulation. Timestamp in panels (a), (c), and (d) indicates the time elapsed from IR irradiation starting.
Multiphysics Conductive And Radiative Heat Transfer Model, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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Image Search Results


(a) Thermal images of ITO-10 NP samples printed with different parameters, exposed to IR lamp irradiation (100 W@50 cm), acquired ad different times, as in panel (b); sample 25DS 1 L, 25DS 2 L, 25DS 2 L, and 25DS 2 L refer to various combinations of drop spacing (DS = 25, 50 μm) and number of printed layers (L = 1, 2). (b) Thermal dynamics of the same samples, averaged with an ROI (region of interest) of 0.5 × 0.5cm 2 placed in the center of the printed squares. Irradiation with the IR lamp starts at 0 s and ends at 36 s. (c) Evaluation of thermal pattern resolution considering the two different designs “interline” and “linewidth”, performed on a specific printed sample exposed to the IR lamp (100 W@50 cm): interline on the left has widths of 2500, 1000, 500, and 250 μm (from top to bottom); linewidth on the right has widths of 2500, 1000, 500, and 250 μm (from top to bottom). (d) Simulated thermal image of the 25DS 1 L square sample (1 cm side) obtained by finite element modeling (FEM) Multiphysics software. (e) Thermal resolution, evaluated as the gradient of temperature along the x axis at the edge of the ITO square vs substrate thickness and time, obtained by simulation. Timestamp in panels (a), (c), and (d) indicates the time elapsed from IR irradiation starting.

Journal: ACS Applied Materials & Interfaces

Article Title: Invisible Thermoplasmonic Indium Tin Oxide Nanoparticle Ink for Anti-counterfeiting Applications

doi: 10.1021/acsami.2c10864

Figure Lengend Snippet: (a) Thermal images of ITO-10 NP samples printed with different parameters, exposed to IR lamp irradiation (100 W@50 cm), acquired ad different times, as in panel (b); sample 25DS 1 L, 25DS 2 L, 25DS 2 L, and 25DS 2 L refer to various combinations of drop spacing (DS = 25, 50 μm) and number of printed layers (L = 1, 2). (b) Thermal dynamics of the same samples, averaged with an ROI (region of interest) of 0.5 × 0.5cm 2 placed in the center of the printed squares. Irradiation with the IR lamp starts at 0 s and ends at 36 s. (c) Evaluation of thermal pattern resolution considering the two different designs “interline” and “linewidth”, performed on a specific printed sample exposed to the IR lamp (100 W@50 cm): interline on the left has widths of 2500, 1000, 500, and 250 μm (from top to bottom); linewidth on the right has widths of 2500, 1000, 500, and 250 μm (from top to bottom). (d) Simulated thermal image of the 25DS 1 L square sample (1 cm side) obtained by finite element modeling (FEM) Multiphysics software. (e) Thermal resolution, evaluated as the gradient of temperature along the x axis at the edge of the ITO square vs substrate thickness and time, obtained by simulation. Timestamp in panels (a), (c), and (d) indicates the time elapsed from IR irradiation starting.

Article Snippet: We implemented a 3D heat transfer model in COMSOL Multiphysics v5.6 in order to investigate the achievable thermal resolution as a function of substrate thickness and exposure time.

Techniques: Irradiation, Software